日期:2022/06/25   IAE 

Emoto Yu, director of TSMC Japan's 3D IC R&D Center, said that the industry trend from 5G and high-performance computing-related applications drives the structural demand for semiconductors, and further technological innovation is needed to meet this demand.

A number of Japanese companies have key materials and technologies in the global semiconductor supply chain. TSMC will continue to devote itself to semiconductor process innovation through joint research and development. At the same time, it has become a bridge of cooperation between the partners of the 3D IC R&D center and world-class semiconductor customers.

TSMC said that the TSMC Japan 3D IC R&D Center focuses on the material field of next-generation 3D silicon stacking and advanced packaging technology, mainly supporting system-level innovation, improving computing performance and integrating more functions. On the way to push semiconductor technology forward, in addition to the traditional way of reducing the size of transistors, a new path has been opened.